Solderless Breadboard, One Column Manufacturer,Supplier and Exporter in India
Product Code : SCL-M-11669
The Solderless
Breadboard Assembly is a high-density 630-point prototyping platform engineered
for the rapid development and debugging of analog and digital circuits.
Adhering to standard 0.1” pitch spacing for ASTM-compliant component
integration, this unit is designed for University-level electrical engineering
and Vocational TVET laboratories. It facilitates high-fidelity terminal
connections without thermal stress or permanent soldering requirements.
Technical Specifications
|
Tender Specification |
OEM Technical Detail |
|
Material Grade |
High-Insulation ABS Housing;
Nickel-Plated Phosphor Bronze Contacts |
|
Total Contact Matrix |
630 Tie-Points (Solderless) |
|
Bus Strip Configuration |
2 Integrated Power
Distribution Strips |
|
Pitch Spacing |
0.1” (Standard 2.54 mm) |
|
Breadboard Dimensions |
6.5” L x 2.3” W |
|
Integrated Baseplate |
Metal Alloy; 7.25” L x 4.25”
W |
|
Interface Terminals |
3 Insulated Binding Posts for
External Power Supply Coupling |
|
Stability Components |
4 Non-Slip Rubber Support
Feet |
Key Pedagogical Outcomes
· Screen-Printed
Alphanumeric Coordinates:
Facilitates error-free circuit mapping and schematic translation, supporting
"Application" and "Analysis" of complex multi-stage logic
gates.
· Standardized
0.1" Hole Spacing:
Ensures universal compatibility with Dual In-line Package (DIP) Integrated
Circuits and Transistors, allowing students to "Create" functional
prototypes from theoretical models.
· Modular
Interlocking Strips: Allows for the
expansion of the working area by connecting multiple units, supporting "Synthesis"
of larger-scale systems such as microcontrollers and sensor arrays.
· Integrated
Metal Baseplate with Binding Posts: Provides a rigid, grounded platform for secure connection to
laboratory power supplies, reinforcing "Evaluation" of electrical
safety and signal interference protocols.
International Logistics & Compliance
This instrumentation
is prepared for global distribution via export-grade seaworthy crating
(ISPM-15 compliant) to protect internal spring-contacts from
high-salinity maritime environments. Comprehensive documentation is included
per shipment: the Manufacturer’s Authorization Form (MAF),
IQ/OQ/PQ Certification for institutional verification, and User Manuals in
technical English. The hardware features a tropicalized design,
with contact alloys tested for sustained conductivity in environments up to
45°C and 90% non-condensing humidity.
